The company is set to release its latest quarterly earnings on Tuesday, April 28th, with a consensus estimate EPS of 0.1708.
ASE Technology Holding Co., Ltd. (ASX) experienced a price drop of 99 cents, representing a -3.21% decrease from the previous close. Notable insider trading activities by director Chen Jeffrey were observed, with significant sale transactions.
The most recent quarterly earnings report, released on Wednesday, February 11th, showed a consensus estimate EPS of 0.2. Further details on revenue and profit margins are not available in the provided data.
ASX offers a forward dividend yield of 4.77%, with a dividend per share MRQ of 35.603 cents, reflecting a year-over-year increase of 12.6107 cents.
Key financial ratios for ASX include a gross profit margin of 19.52%, operating profit margin of 9.94%, net profit margin of 8.27%, and a return on equity of 4.24. The company also demonstrates a healthy cash position with cash per share at $23.39.
This financial report highlights upcoming earnings expectations, recent performance, dividend distribution, and key financial ratios for ASE Technology Holding Co., Ltd. (ASX). Investors should consider these factors in their assessment of the company's financial health and performance.
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.